TRI System（Samsung‘s only certified and T-treated supplier）

一种不使用粘合剂而将金属和树脂一体化的技术.

A technology that integrates metals and resins without using adhesives.

双重结合 Dual combination

1、物理结合：金属表面经过TRI处理后形成纳米孔洞，注塑过程中塑胶料的基体注入纳米孔洞产生物理层面的结合.

Physical bonding: After TRI treatment, metal surfaces form nanopores, and during the injection molding process, the matrix

 of plastic materials is injected into the nanopores to achieve a physical bonding.

2、化学反应链接合：金属表面经TRI处理后形成一层厚度200nm左右的接合层，接合层内含有能促进树脂和金属结合的物质，在高温高压下产生

化学反应，使树脂与金属牢固结合，并产生高密封状态。

Chemical reaction bonding: After TRI treatment, the metal surface forms a bonding layer about 200 nm thick, containing su

bstances that promote resin-metal bonding. Under high temperature and pressure, chemical reactions occur to ensure a stro

ng bond between the resin and metal, resulting in a high-seal state.

TRI 金属表面处理技术原理动画